Compatible Systems RISC 2800i Instrukcja Użytkownika Pobierz pdf (Strona 12)

MPC7448 RISC Microprocessor Hardware Specifications, Rev. 4

12 Freescale Semiconductor

Electrical and Thermal Characteristics

Table 5 provides the package thermal characteristics for the MPC7448. For more information regarding

thermal management, see Section 9.7, “Power and Thermal Management Information.”

Table 6 provides the DC electrical characteristics for the MPC7448.

Table 5. Package Thermal Characteristics

Characteristic Symbol Value Unit Notes

Junction-to-ambient thermal resistance, natural convection, single-layer (1s) board R

26 •C/WC/W 2, 3

Junction-to-ambient thermal resistance, natural convection, four-layer (2s2p) board R

JMA

19 •C/WC/W 2, 4

Junction-to-ambient thermal resistance, 200 ft/min airflow, single-layer (1s) board R

JMA

22 •C/WC/W 2, 4

Junction-to-ambient thermal resistance, 200 ft/min airflow, four-layer (2s2p) board R

JMA

16 •C/WC/W 2, 4

Junction-to-board thermal resistance R

11 •C/WC/W 5

Junction-to-case thermal resistance R

< 0.1 •C/WC/W 6

Notes:

1. Refer to Section 9.7, “Power and Thermal Management Information,” for details about thermal management.

2. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal

resistance.

3. Per JEDEC JESD51-2 with the single-layer board horizontal

4. Per JEDEC JESD51-6 with the board horizontal

5. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

6. This is the thermal resistance between die and case top surface as measured by the cold plate method (MIL SPEC-883

Method 1012.1) with the calculated case temperature. The actual value of R

θJC

for the part is less than 0.1°C/W.

Table 6. DC Electrical Specifications

At recommended operating conditions. See Table 4.

Characteristic

Nominal Bus

Voltage

Symbol Min Max Unit Notes

Input high voltage

(all inputs)

1.5 V

× 0.65 OV

+ 0.3 V 2

1.8 OV

× 0.65 OV

+ 0.3

2.5 1.7 OV

+ 0.3

Input low voltage

(all inputs)

1.5 V

–0.3 OV

× 0.35 V 2

1.8 –0.3 OV

× 0.35

2.5 –0.3 0.7

Input leakage current, all signals except

BVSEL0, LSSD_MODE

, TCK, TDI, TMS,

TRST

= OV

= GND

—I

—

– 50

µA 2, 3

Input leakage current, BVSEL0,

LSSD_MODE

, TCK, TDI, TMS, TRST:

= OV

= GND

—I

—

– 2000

µA 2, 6

1 2 ... 7 8 9 10 11 12 13 14 15 16 17 ... 59 60

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